• Efficient yet simple operation
• Flexibility in usage
• CE Approved

• This is a forced hot air convection type reflow Oven, where air is directed at right angles to the board surface. This produces maximum turbulence and maintains even temperature across the width of the boards.
• The reflow has five time zones with programmable control of each time zone.  
• Ramp selection and temperature setting for Preheat and reflow.
• Time setting for soaking Dwell (Reflow) and cooling.
• Direct profile setting by setting each portion of profile through menu.
• Stores up to 50 profiles.
• Does not need additional computer to run the machine.

Easy to Operate

• This compact, space saving, table top model is easy to operate and requires minimal operator training, PCBs to be soldered are kept stationary on a mesh tray in a sealed environment. The heater is switched ON/ OFF by a microcontroller based on profile setting and actual temperature inside the oven.
• The motorised tray comes out automatically at the end of cycle for unloading and reloading of PCBs. A manual override is provided to open tray in case of power failure.

• Can be used effectively to cure glue and epoxy.
• Component temperature cycling for QC purpose is possible.
• Profile repetition facility of 10 times.