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Pick and Place Systems |
- High Accuracy, High Flexibility for
- 0201 (20mm Laser Head only)
- SOIC, PLCC
- BGA, µBGA,CSP
- QFP (0.5mm pitch)
- Smart Feeder ID Function for speedy Set-up, easy operation
- Suitable for small volume production
- Vision Alignment System for fine pitch QFP and BGA
- Built-in Camera System with auto Fiducial Mark Learning
- Dispenser System
- Vision Inspection for before or after production
- Universal CAD Conversion
Windows 2000
- Operation Perform
- Ball Screw System
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Strong & Rigid Structure
BS383 using heavy duty and high precision Linear Ball Rail system to provide strong, rigid and long life time mechanism. |
Ball Screw System
BS383 using pre-loaded ball screw with closed loop DC-Servo motor system, provide high repeatability and stability. |
Vision Alignment System
Optional Vision Alignment system for 0.5mm fine pitch QFP, BGA, µBGA & CSP. |
Touchless Laser
Alignment System for 0201
Optional Laser Alignment for 0201 component and QFP |
Dispenser System
With the optional stand alone dispenser head which can dispense adhesive/ solder paste suitable for quick small volume production without making stencil. |
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Flexibility Fiducial Mark System
Circular, Square solder pad or even a plated through hole can be use as a fiducial mark for recognition. |
