| Kit Name |
Main Components |
|
QFP Tool |
QFP Lead Straightening Tool |
| FC176 Flip Chip Laminate Substrate |
176 Bump Flip Chip 204µm |
| FC88 Flip Chip Laminate Substrate |
88 Bump Flip Chip 204µm |
| FC317 Flip Chip Laminate Substrate |
317 Bump Flip Chip 254µm |
| FC220 Flip Chip Laminate Substrate |
220 Bump Flip Chip 204µm |
| CBGA196 with Ceramic Substrate |
4x CBGA196 1.27mm pitch |
| CBGA1089 with Ceramic Substrate |
2x CBGA1089 1.27mm pitch |
| FC96 Flip Chip Ceramic Substrate |
FC96 Flip Chip 457µm |
| FC96 Flip Chip Laminate Substrate |
FC96 Flip Chip 457µm |
| FC48 Flip Chip Ceramic Substrate |
FC48 Flip Chip 457µm |
| FC48 Flip Chip Laminate Substrate |
FC48 Flip Chip 457µm |
| Beginner's Throughhole |
24 Traditonal Throughhole Components |
| CCGA1089 Ceramic Substrate |
Ceramic Substrate for CCGA1089 |
| Re-certification by Hand |
Low Cost Mixed Technology for Re-certification |
| Multilayer Lead Free Throughhole |
DIP14 Daisy Chain + Connector + Zero Ohm Resistors + Capillary PTH Test |
| Mixed Technology 2 |
Fine Pitch SMD and BGA, Chips and Throughhole |
| Multipurpose Throughhole Machine Run |
200 different Throughhole components |
| Multipurpose Throughhole Hand Assembly |
200 different Throughhole components |
| BGA352-BGA400 Kit |
BGA352 1.27mm & BGA400 1.5mm |
| Philips Machine Run |
Large board 9"x8" 0201 chips, BGA, uBGA, Flip Chips, TQFP .3mm pitch |
| Challenger 1 |
See new Challenger 2 #928001 |
| µBGA TV46 |
Tessera µBGA CSP46 0.75mm pitch |
| µBGA TV74 |
Tessera µBGA CSP74 Obsolete |
| µBGA TV188 |
Tessera µBGA CSP188 |
| Beginners SMD |
Simple Kit with PLCC, SOIC, SOT, Chips |
| SMD Introductory Kit |
QFP, PLCC, SOIC, SOT, Chips |
| Practical Hand Kit |
QFP, PLCC, SOIC, SOT, DIP, chips |
| Challenger 2 Kit |
QFP, BGA, PLCC, SOIC, SOT, Chips |
| Jumbo Chip Kit |
0402, 0603, 0805, 1206 chips |
| Advanced SMD 1 |
QFP, TQFP, TSOP |
| Advanced SMD 2 |
QFP,TQFP, TSOP |
| µBGA TV62 |
Tessera µBGA CSP62 RAMBUS 0.8mm/1.0mm asymetrical pitch with daisy chain |
| µBGA TV208 |
Tessera µBGA CSP208 RAMBUS 0.5mm |
| Stencil Eval 0.3mm Pitch |
TQFP, QFP, BGA, TSOP, PLCC |
| Stencil Eval 0.4mm Pitch |
QFP, BGA, TSOP, PLCC |
| BGA256/272 Kit |
BGA256/272 Pitch 1.27mm |
| Econo Kit 2 |
TQFP, SO, DIP, Chips |
| Econo Kit 3 |
QFP, PLCC, SO, DIP, Chips + throughhole |
| Monster Kit |
See 948001 |
| 0.3mm Pitch Kit |
TQFP168 |
| Rework Practice 2 |
QFP, PLCC, SOIC, SOT, chips |
| PCMCIA |
LQFP, TSOP, Chips |
| Universal BGA 1.27/1.5mm |
BGA for 1.27mm and 1.5mm pitch without daisy-chain |
| Multiple BGA |
Daisy-chain Top: BGA196/256/272/352/388 Back: BGA225/352/388 |
| Monster Kit 2 |
Combines Advanced 930001 and Challenger 2 Kits 928001 |
| 0201 / 0401 Kit |
0201 chips on top side and 0402 chips on back side of board |
| SABER Array |
4-Board array Mixed Technology designed by SMTA fine-pitch, BGA, TSOP, SIR coupon, Wave solder coupons, etc |
| Multiple CBGA |
CBGA121,196,256,304,361,625 on FR-4 Board |
| LBGA209 |
Memory Board BGA209 1.0mm 11x19 matrix |
| Visual Placement Inspection |
Acrylic with sticky surface for BGA 1.27mm and 1.5mm pitch |
| Visual Placement Inspection |
Acrylic with sticky surface for µBGA and CSP 0.5mm to 0.8mm pitch |
| Visual Placement Inspection |
Acrylic with sticky surface for 0.8mm and 1.0mm BGA |
| Visual Placement Inspection |
Acrylic with sticky surface for Flip Chip 204um, 254um and 457um pitch |
| Visual Placement Inspection |
Acrylic with sticky surface for Flip Chip Grid Lines 4mil to 20mil |
| Visual Placement Inspection |
View of Layers of Typical Visual Boards |
| CBGA196 and CBGA625 |
CBGA196/625 with daisy chain |
| BGA1225 and BGA1089 |
BGA1225 & BGA1089 with daisy chain |
| Machine Diagnostic Kit |
3 Machine Diagnotic kits: Speed, Rotational & Fiducials |
| TSOP32 Kit |
9 each TSOP32 0.5mm pitch |
| Fiducial Evaluation |
QFP100 with 10 different fiducial marks |
| BQFP132 |
BQFP132 25 mils |
| QFP160 |
QFP160 0.65mm Pitch |
| 360° Rotational Placement |
TSOP, SO, Chips |
| Multiple QFP 0.4mm to 0.8mm |
QFP120, QFP160, QFP208, QFP256 |
| QFP208 |
QFP208 0.5mm Pitch |
| QFP256 |
QFP256 0.4mm Pitch |
| Universal BGA 0.5mm - 0.8mm |
Universal BGA with non-daisy chain pads for 0.5mm, 0.75mm and 0.8mm pitch |
| Chip Shooter 0402 / 0603 |
0402 and 0603 Chips |
| Rework Practice 1 |
QFP, PLCC, SOIC, SOT, chips |
| BGA169 / 225 Daisy Chain Test |
BGA169 and BGA225 1.5mm pitch |
| Chip Shooter 0805 / 1206 |
0805 and 1206 Chips |
| Mixed Technology 1 |
QFP, PLCC, SOIC, SOJ, Chips, DIP |
| SMD Bread Board |
Snaps apart for Prototyping |
| Sample Display Boards for Show & Tell |
Parts mounted in plastic case |
| Not used |
Internal Use |
| CCGA1089 - 1.27mm and CCGA1247 - 1.0mm |
Column Grid Array FR4 Board |
| eBGA1600 1.0mm pitch |
eBGA1600 1.0mm |
| Metcal Rework Practice Board |
Rework Practice Board 3 |
| Universal BGA 1.0mm / 0.8mm |
Universal BGA board for 1.0mm and 0.8mm pitch |
| Lead Free QFP208 |
QFP208 with Ni-Pd leads and tin board |
| Lead Free 0805 / 1206 chips |
0805 and 1206 chips with tin terminations and tin board |
| Lead Free 0402 / 0603 chips |
Lead Free 0402 and 0603 chips |
| Lead Free BGA |
Top: BGA196/256/272/352/388 Back: BGA225/352/388 |
| Lead Free BGA and Fine Pitch |
Lead Free BGAs, QFP, chips |
| BGA and Fine Pitch |
HASL Sn/Pb version of 986001 |
| Global Fiducial Only |
Global Fiducial Only 5.5" x 8" |
| Fine Pitch BGA 0.8mm / 1.0mm Pitch |
fBGA672 1.0mm and BGA100 0.8mm pitch |
| BGA Substrates |
Practice Substrates for BGA Semiconductor Manufacturing Equipment |
Practice Kits